carrier:start
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Table of Contents
General construction
See Carrier components
Surface mount technology (SMT)
Through hole
Transistor outline (TO)
Generic terms and special packaging
CERPACK
Ceramic package
COB (Chip-On-Board)
Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch.
Example showing wire bonding to PCB:
COF (Chip-On-Flex)
A variation of COB, where a chip is mounted directly to a flex circuit
COG (Chip-On-Glass)
A variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD
CSP (Chip Scale Package)
Package no more than 1.2x the size of the silicon chip.
LTCC (Low Temperature Co-fired Ceramic)
???
MCM (Multi-Chip Module)
Several dies integrated into one package.
MICROARRAY
Usually refers to a chip for testing DNA
TCSP (True Chip Size Package), TDSP (True Die Size Package)
Package is the same size as silicon.
References
1. http://en.wikipedia.org/wiki/Chip_carrier
carrier/start.1330889575.txt.gz · Last modified: 2013/10/20 14:59 (external edit)