Ceramic package

Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch. There seem to be two types:

• Epoxy blob (below type): die is placed on board, bonded, and then covered with a blob of epoxy. The most common type
• Upside down dies (above type): likely WLCSP with underfill. Basically a BGA where there is no encapsulant on the die and solder balls are attached directly to bond pads
• Flexible circuit: these are common in the line drivers on LCD screens

Example showing wire bonding to PCB:

A variation of COB, where a chip is mounted directly to a flex circuit

A variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD

Package no more than 1.2x the size of the silicon chip.

???

Several dies integrated into one package. Considerable variety.

Usually refers to a chip for testing DNA

Package is the same size as silicon.

• http://en.wikipedia.org/wiki/Chip_carrier
• http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types