Lapping machine

Image	Model	Description	Platen	Platen diameter	Power	Size class	Polish method	Manual	Notes
	Akribis-air								Large / floor model for wafers
	BC 3000								3 plate large “vacuum bonding system”
	CPM2								older benchtop
	CP3000								3 workstations
	CP4000								9 workstations
	DL1								Large for wafers
	DL4								Large for wafers
	DP1								Large for wafers
	DP4								Large for wafers
	LP50								High quality machine, up to three samples
	PM2								older benchtop
	PM2A								older benchtop
	PM5								Like LP50 but only one sample
	Tribo								Enclosed large benchtop machine
	WG2								Based on PM5 for polishing geological samples

Jig

Image	Model	Description	Manual	Notes
	CJ30
	PP5			Precision lapping and polishing jig. +/- 1.5 degree
	PP6			Precision lapping and polishing jig. +/- 1.5 degree
	PP8			Precision lapping and polishing jig. +/- 1.5 degree
	PP8D			diamond only
	PP9			Precision lapping and polishing jig
	PLJ2			Conventional (not three point)
	PLJ7			Conventional (not three point)