Die attach materials [Plastic MEMS 49, sourced as Pecht et al., 1999…I have no idea where it lies in the giant book]:

• Silicone
• Urethane
• Acrylic
• Epoxy silicone
• Epoxy novlak
• Polymide
• Epoxy polymide
• Modified polymide
• Epoxy bisphenol

“Common materials used in packaging…Die bonding” [Plastic MEMS 52]:

• Solder alloys
• Epoxy resins
• Silicone rubber

Die attach materials [Plastic MEMS 70]:

• Polymer: resin based epoxies or polymides
• Solder die attach
• Gold eutectic die attach

From datasheets:

• Ablestik 8361J [Mindspeed product change note]
• CRM-M0209 [Mindspeed product change note]
• Ablestik 84-1 LMISR4 [Mindspeed product change note]
• Ablestik 3230 [Mindspeed product change note]
• Ablestik 8361H [Cypress S32456]
• 843J [Hana BOM]
• 2200D [Hana BOM]
• 2600AT [Hana BOM]
• 8290 [Hana BOM]
• LE5030 [Hana BOM]
• AB2033SC [Hana BOM]

References